Main Features
● High uniformity projection and imaging units,supporting customization of the entire hardware platform;
● Uses incoherent white light source,avoiding noise caused by interference phenomena from coherent light sources like lasers;
● Projection and imaging units configured at specific angles to enhance imaging signal strength;
● Extremely low exposure time(min.1μs),very high scanning speed(max.500mm/s),significantly improving WPH(Throughput);
● Automatic switching of multiple magnification objectives,meeting different height and precision measurement requirements;
Product Applications
● Suitable for types such as copper pillars,plating,gold bumps,micro bumps,etc.Capable ofbump height measurement,coplanarity,PR/PI thickness measurement,through-hole depth measurement,and multi-surface measurement.
● Applicable to industries like semiconductors,ICs,and new energy.
