Product

3D White Light Triangulation Sensor

● High uniformity projection and imaging units,supporting customization of the entire hardware platform; ● Uses incoherent white light source,avoiding noise caused by interference phenomena from coherent light sources like lasers; ● Projection and imaging units conﬁgured at speciﬁc angles to enhance imaging signal strength; ● Extremely low exposure time(min.1μs),very high scanning speed(max.500mm/s),signiﬁcantly improving WPH(Throughput);

Product introduction

Main Features
● High uniformity projection and imaging units,supporting customization of the entire hardware platform;
● Uses incoherent white light source,avoiding noise caused by interference phenomena from coherent light sources like lasers;
● Projection and imaging units conﬁgured at speciﬁc angles to enhance imaging signal strength;
● Extremely low exposure time(min.1μs),very high scanning speed(max.500mm/s),signiﬁcantly improving WPH(Throughput);
● Automatic switching of multiple magniﬁcation objectives,meeting diﬀerent height and precision measurement requirements;

Product Applications
● Suitable for types such as copper pillars,plating,gold bumps,micro bumps,etc.Capable ofbump height measurement,coplanarity,PR/PI thickness measurement,through-hole depth measurement,and multi-surface measurement.

● Applicable to industries like semiconductors,ICs,and new energy.

Standard Product Numbering

Parameter Specifications

Typical Package Schematic(mm)

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